You do not have permission to edit this page, for the following reason:
You can view and copy the source of this page.
x
1
2
== Abstract ==3
4
This paper presents an innovative cooling solution for active phased array antennas,5
using a 3D printed liquid cooling device integrated in the structure’s PCB.6
7
== Full document ==8
<pdf>Media:Draft_Content_808369661-p7-8253-document.pdf</pdf>9
10
11
== References ==12
13
[1] “Advanced Concepts for AeroStructures with Integrated Antennas and Sensors”, [http://www.acasias-project.eu/ http://www.acasias-project.eu/]14
15
[2] Ebert, T., „Metallkühler für Leistungsbauteile aus dem 3D-Laserdrucker“, ''Elektronik Praxis: Sonderheft Leistungselektronik ''(2018), 20 -22.16
17
[3] Wienhausen, A.H., Sewergin, A., de Doncker, R., Highly Integrated Two-Phase SiC Boost Converter with 3D Printed Fluid Coolers and 3D Printed Inductor Bobbins, ''Proc. PCIM Europe; Int. Exhibition & Conf. Power Electr., Intelligent Motion, Renewable Energy & Energy Mgmt ''(2018) 1-8.18
19
[4] Curran, B., Reyes, J., Tschoban, C., Höfer, J., Grams, A., Wüst, F., Hutter, M., Leiß, J., Martinez-Vazquez, M., Baggen, R., Ndip, I., Lang, K-D., “Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front-Ends for Phased Arrays up to 60 GHz”, ''IEEE Trans. Comp., Packaging & Manufacturing Techn. ''(2018), '''8:'''1231-1240.20
21
<span id='_GoBack'></span>22
Return to LeiB et al 2020a.
Back to Top
