Abstract

This paper presents an innovative cooling solution for active phased array antennas, using a 3D printed liquid cooling device integrated in the structure’s PCB.

Full document

The PDF file did not load properly or your web browser does not support viewing PDF files. Download directly to your device: Download PDF document

References

[1] “Advanced Concepts for AeroStructures with Integrated Antennas and Sensors”, http://www.acasias-project.eu/

[2] Ebert, T., „Metallkühler für Leistungsbauteile aus dem 3D-Laserdrucker“, Elektronik Praxis: Sonderheft Leistungselektronik (2018), 20 -22.

[3] Wienhausen, A.H., Sewergin, A., de Doncker, R., Highly Integrated Two-Phase SiC Boost Converter with 3D Printed Fluid Coolers and 3D Printed Inductor Bobbins, Proc. PCIM Europe; Int. Exhibition & Conf. Power Electr., Intelligent Motion, Renewable Energy & Energy Mgmt (2018) 1-8.

[4] Curran, B., Reyes, J., Tschoban, C., Höfer, J., Grams, A., Wüst, F., Hutter, M., Leiß, J., Martinez-Vazquez, M., Baggen, R., Ndip, I., Lang, K-D., “Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front-Ends for Phased Arrays up to 60 GHz”, IEEE Trans. Comp., Packaging & Manufacturing Techn. (2018), 8:1231-1240.

Back to Top
GET PDF

Document information

Published on 15/02/21
Accepted on 03/03/21
Submitted on 03/03/21

DOI: 10.23967/emus.2019.006
Licence: CC BY-NC-SA license

Document Score

0

Views 17
Recommendations 0

Share this document

claim authorship

Are you one of the authors of this document?