The effective dispersal of thermal energy from mechanical and electronic devices is a critical function of heat sinks, especially in the dynamic electronic industry. The convergence of rising power efficiency and the need for miniaturization has underscored the significance of creating heat sink configurations that are not only efficient but also capable of maintaining performance without necessitating expansion. This review article provides an exhaustive examination of recent developments in heat transfer enhancing methods, with a specific emphasis on a range of heat sink configurations and design approaches. Thermal efficiency expressed as a pin termination circular and pin fin square is assessed in the present research, Pin Fin Elliptical, and Channel Heat Sink designs. Comparative results indicate that Pin Fin Circular exhibits good performance, while Pin Fin Elliptical shows better results. The numerical analysis includes considerations of thermal performance, surface area, manufacturing complexity, and 2D models. Pin Fin Circular, with its efficient heat dissipation and moderate complexity, emerges as a promising option. The paper evaluates the applicability of additional manufacturing processes, including EDM, etching, casting, extrusion, and machining, for prototyping and mass production. A detailed investigation of manufacturing methods shows that, contingent upon the method used, Pin and Channel designs possess unique merits and demerits. In addition, the study emphasises the importance of cost aspects during the design process. Also, the assessment examines the current status and potential future advancements of heat sink technology, placing particular emphasis on the necessity for unique designs, materials, and versatile manufacturing methods. The incorporation of Nano fluids technology and the exploration of structural design perspectives are identified as potential avenues for future research. This work aims to provide a comprehensive overview of recent developments in heat sink technology, offering insights into thermal performance enhancement and guiding future studies in this critical field.

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Published on 10/03/24

Licence: CC BY-NC-SA license

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