Sofi et al 2025a - Revision history

Marherna: Marherna moved page Review 199156902404 to Sofi et al 2025a

2025-06-26T19:48:45Z

Marherna moved page Review 199156902404 to Sofi et al 2025a

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2025-04-14T11:17:15Z

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2025-04-14T11:15:17Z

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2025-04-14T10:33:05Z

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Tasdeeq at 10:21, 14 April 2025

2025-04-14T10:21:29Z

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Tasdeeq at 09:43, 14 April 2025

2025-04-14T09:43:34Z

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Tasdeeq: Tasdeeq moved page Draft Sofi 982456237 to Review 199156902404

2025-04-14T09:15:38Z

Tasdeeq moved page Draft Sofi 982456237 to Review 199156902404

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@@ Line 80: / Line 80: @@
 <div id="_Ref195111887" class="center" style="width: auto; margin-left: auto; margin-right: auto;">
-Figure 5: Conductivity of CNT-GNP doped epoxy ink for different dispersions.</div>
+Figure 5: Conductivity of CNT-GNP doped epoxy ink for different dispersions.
 <span id='cite-_Ref195525577'></span>[[#_Ref195525577|Figure 6]] presents the electrical conductivity of several silver-based inks, both pure and modified with different nanoparticle loadings. The unmodified silver ink achieves a conductivity of approximately 2.58 × 10⁴ S/m, which increases significantly with the addition of nanomaterials. Incorporating 1 %wt. GNP increases the conductivity by roughly 7% over the baseline, whereas a 2 %wt. GNP modification boosts it to approximately 2.4 times the original value. In comparison, adding 1 %wt. CNT-GNP results in an increase to about 1.9 times the baseline conductivity, while the multilayer silver ink achieves a conductivity near 1.6 times that of the unmodified ink. Although the inclusion of CNT does enhance the conductivity, the improvement is lower than that observed with GNP alone. Microscopic examination of the printed circuits indicated that dispersing CNT uniformly within the silver ink is challenging, likely leading to less effective conductive network formation. This suggests that the superior performance of the GNP-modified inks is partly due to their more consistent dispersion, which facilitates better particle connectivity and, consequently, enhanced electron transport.
@@ Line 93: / Line 95: @@
 A comparative analysis of signal transmission for different interconnection configurations between AUCTs and GW generator and receiver equipment is presented in <span id='cite-_Ref195112505'></span>[[#_Ref195112505|Figure 7]]. The results are presented for four ink types: silver ink containing 2 %wt. GNP, multilayered silver ink, and a nanoparticle-doped epoxy matrix incorporating 4 %wt. CNT and 6 %wt. GNP.  The results are presented for two different frequencies 50 kHz and 250 kHz representing which represent cases where two fundamental modes namely A0 and S0 generally emerge for similar material, with similar layup and thickness [8]. The signals transmitted and received through both the copper cables and the silver-based printed circuits particularly incorporating GNPs exhibited nearly identical waveforms in terms of amplitude and signal fidelity. This indicates that silver-based printed circuits possess excellent transmission characteristics, closely matching those of traditional copper conductors, and thus represent a viable lightweight alternative for signal transmission. Notably, at the lower excitation frequency of 50 kHz, silver circuits demonstrated even higher signal amplitudes than copper cables in some configurations, underscoring their potential to enhance signal quality while reducing system weight. On the other hand, circuits fabricated with nanoparticle-doped epoxy also supported signal propagation but exhibited significantly higher resistive losses. Specifically, when the actuator–receiver configuration involved the epoxy-based printed circuit, the signal amplitude was reduced by a factor of approximately three at 50 kHz when the circuit served as a receiver, and by a factor of two when acting as an actuator. Interestingly, this behavior reversed at 250 kHz: the signal loss was greater when the epoxy-based circuit functioned as an actuator (approximately threefold compared to copper) and comparatively lower about twofold when used as a receiver. These observations highlight the influence of both frequency and material conductivity on signal transmission, with silver-based printed circuits offering better performance across both tested frequencies.
 {|
@@ Line 126: / Line 127: @@
 Figure 8: AUCT-printed circuit film.</div>
-The impedance spectra of the AUCT under various bonding configurations, including a free AUCT, a broken AUCT, an oven-bonded AUCT, and the AUCT integrated within the printed circuit film is presented in <span id='cite-_Ref195112790'></span>[[#_Ref195112790|Figure 9]]. A comparison between the impedance response of the integrated film AUCT and the broken AUCT confirms that the transducer remained operational following the bonding process. Notably, the resonant frequency of the integrated AUCT shifted toward that of the oven-bonded configuration, suggesting successful bonding. These results highlight the feasibility of fabricating and bonding flexible, printed circuit films with integrated AUCTs for scalable SHM system integration, though further optimization is needed for improved performance and stability.
+The impedance spectra of the AUCT under various bonding configurations, including a free AUCT, a broken AUCT, an oven-bonded AUCT, and the AUCT integrated within the printed circuit film is presented in <span id="cite-_Ref195112790"></span>[[#_Ref195112790|Figure 9]]. A comparison between the impedance response of the integrated film AUCT and the broken AUCT confirms that the transducer remained operational following the bonding process. Notably, the resonant frequency of the integrated AUCT shifted toward that of the oven-bonded configuration, suggesting successful bonding. These results highlight the feasibility of fabricating and bonding flexible, printed circuit films with integrated AUCTs for scalable SHM system integration, though further optimization is needed for improved performance and stability.
 <div class="center" style="width: auto; margin-left: auto; margin-right: auto;">

@@ Line 28: / Line 28: @@
 Both types of inks were printed using a BCN3D Plus 3D printer, equipped with a paste extruder module. A syringe attached to the extruder was used to deposit the conductive paths. The complete printing setup is illustrated in <span id='cite-_Ref195108592'></span>[[#_Ref195108592|Figure 1]]. After printing, the nanoparticle-doped epoxy ink was initially cured at room temperature, followed by a post-curing step using Joule heating to enhance their mechanical and electrical properties [5]. The silver ink was sintered at 150 °C after printing.
-<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Review_199156902404-image1.PNG|centre|420x420px|[[File:Review 199156902404-image1.png|thumb|265x265px]]]]</div>
+<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Figure 1 Printer setup..png|centre|420x420px|[[File:Review 199156902404-image1.png|thumb|265x265px]]]]</div>
 <div id="_Ref195108592" class="center" style="width: auto; margin-left: auto; margin-right: auto;">
@@ Line 62: / Line 62: @@
 ==3. Results==
-==3.1. Weight comparison==
+===3.1. Weight comparison===
 In <span id='cite-_Ref195110907'></span>[[#_Ref195110907|Figure 4]], the linear mass density of four different circuit materials are compared. Silver-GNP exhibits the lowest mass density, followed by silver. Copper cable has the highest linear mass density of the four materials. The graph suggests that silver-GNP and Epoxy CNT-GNP offer a significant reduction in linear mass density compared to traditional conductive materials such as copper cable. This reduction could be beneficial in applications where weight is critical, such as in aerospace. Additionally, while silver has a marginally higher density than silver-GNP, the differences between these materials imply that slight modifications in composition can influence the overall mass without necessarily compromising functionality.
@@ Line 72: / Line 72: @@
 Figure 4: Linear mass density of copper cables and printed circuits.</div>
-==3.2. Conductivity and signal transmission==
+===3.2. Conductivity and signal transmission===
 The electrical conductivity of the nanoparticle-doped epoxy inks as a function of filler weight fraction is shown in <span id='cite-_Ref195111887'></span>[[#_Ref195111887|Figure 5]].'' At'' low concentrations (approximately 2.4–4.4 %wt.), the conductivity increases modestly, indicating the formation of isolated conductive clusters that do not yet span the material. However, a pronounced enhancement is observed at around 4.6 %wt., marking the percolation threshold where a continuous, interconnected network of CNT-GNP is formed. This network formation results in a jump of nearly five orders of magnitude in conductivity, demonstrating the critical role of filler interconnectivity. The synergistic interaction between CNTs and GNPs appears to facilitate more effective electron transport pathways, as their combined geometries promote contact and bridging across the composite matrix.
@@ Line 90: / Line 90: @@
 Figure 6: Conductivity values for unmodified and CNT-GNP doped silver circuits.</div>
-==3.3. Signal transmission==
+===3.3. Signal transmission===
 A comparative analysis of signal transmission for different interconnection configurations between AUCTs and GW generator and receiver equipment is presented in <span id='cite-_Ref195112505'></span>[[#_Ref195112505|Figure 7]]. The results are presented for four ink types: silver ink containing 2 %wt. GNP, multilayered silver ink, and a nanoparticle-doped epoxy matrix incorporating 4 %wt. CNT and 6 %wt. GNP.  The results are presented for two different frequencies 50 kHz and 250 kHz representing which represent cases where two fundamental modes namely A0 and S0 generally emerge for similar material, with similar layup and thickness [8]. The signals transmitted and received through both the copper cables and the silver-based printed circuits particularly incorporating GNPs exhibited nearly identical waveforms in terms of amplitude and signal fidelity. This indicates that silver-based printed circuits possess excellent transmission characteristics, closely matching those of traditional copper conductors, and thus represent a viable lightweight alternative for signal transmission. Notably, at the lower excitation frequency of 50 kHz, silver circuits demonstrated even higher signal amplitudes than copper cables in some configurations, underscoring their potential to enhance signal quality while reducing system weight. On the other hand, circuits fabricated with nanoparticle-doped epoxy also supported signal propagation but exhibited significantly higher resistive losses. Specifically, when the actuator–receiver configuration involved the epoxy-based printed circuit, the signal amplitude was reduced by a factor of approximately three at 50 kHz when the circuit served as a receiver, and by a factor of two when acting as an actuator. Interestingly, this behavior reversed at 250 kHz: the signal loss was greater when the epoxy-based circuit functioned as an actuator (approximately threefold compared to copper) and comparatively lower about twofold when used as a receiver. These observations highlight the influence of both frequency and material conductivity on signal transmission, with silver-based printed circuits offering better performance across both tested frequencies.
@@ Line 121: / Line 121: @@
 The developed AUCT-printed circuit film is shown in <span id='cite-_Ref195112657'></span>[[#_Ref195112657|Figure 8]]. The printed circuits were directly connected to the AUCT’s electrical contacts, eliminating the need for traditional soldered copper cables, which are prone to mechanical failure. This direct integration has the potential to improve connection reliability, though further mechanical testing is needed to confirm this.
-<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Review_199156902404-image11.PNG|centre|492x492px|[[File:Review 199156902404-image11.png|thumb|313x313px]]]]</div>
+<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Figure 8- AUCT-printed circuit film..png|centre|492x492px|[[File:Review 199156902404-image11.png|thumb|313x313px]]]]</div>
 <div id="_Ref195112657" class="center" style="width: auto; margin-left: auto; margin-right: auto;">

@@ Line 28: / Line 28: @@
 Both types of inks were printed using a BCN3D Plus 3D printer, equipped with a paste extruder module. A syringe attached to the extruder was used to deposit the conductive paths. The complete printing setup is illustrated in <span id='cite-_Ref195108592'></span>[[#_Ref195108592|Figure 1]]. After printing, the nanoparticle-doped epoxy ink was initially cured at room temperature, followed by a post-curing step using Joule heating to enhance their mechanical and electrical properties [5]. The silver ink was sintered at 150 °C after printing.
-<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">
+<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Review_199156902404-image1.PNG|centre|420x420px|[[File:Review 199156902404-image1.png|thumb|265x265px]]]]</div>
- [[Image:Review_199156902404-image1.PNG|420px]] </div>
 <div id="_Ref195108592" class="center" style="width: auto; margin-left: auto; margin-right: auto;">
@@ Line 98: / Line 97: @@
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-| [[Image:Review_199156902404-image7.png|276px]]
+|[[File:Review_199156902404-image7.png|centre|276x276px]]
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@@ Line 122: / Line 121: @@
 The developed AUCT-printed circuit film is shown in <span id='cite-_Ref195112657'></span>[[#_Ref195112657|Figure 8]]. The printed circuits were directly connected to the AUCT’s electrical contacts, eliminating the need for traditional soldered copper cables, which are prone to mechanical failure. This direct integration has the potential to improve connection reliability, though further mechanical testing is needed to confirm this.
-<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">
+<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">[[File:Review_199156902404-image11.PNG|centre|492x492px|[[File:Review 199156902404-image11.png|thumb|313x313px]]]]</div>
- [[Image:Review_199156902404-image11.PNG|492px]] </div>
 <div id="_Ref195112657" class="center" style="width: auto; margin-left: auto; margin-right: auto;">

@@ Line 83: / Line 83: @@
 Figure 5: Conductivity of CNT-GNP doped epoxy ink for different dispersions.</div>
-Figure 6 presents the electrical conductivity of several silver-based inks, both pure and modified with different nanoparticle loadings. The unmodified silver ink achieves a conductivity of approximately 2.58 × 10⁴ S/m, which increases significantly with the addition of nanomaterials. Incorporating 1 %wt. GNP increases the conductivity by roughly 7% over the baseline, whereas a 2 %wt. GNP modification boosts it to approximately 2.4 times the original value. In comparison, adding 1 %wt. CNT-GNP results in an increase to about 1.9 times the baseline conductivity, while the multilayer silver ink achieves a conductivity near 1.6 times that of the unmodified ink. Although the inclusion of CNT does enhance the conductivity, the improvement is lower than that observed with GNP alone. Microscopic examination of the printed circuits indicated that dispersing CNT uniformly within the silver ink is challenging, likely leading to less effective conductive network formation. This suggests that the superior performance of the GNP-modified inks is partly due to their more consistent dispersion, which facilitates better particle connectivity and, consequently, enhanced electron transport.
+<span id='cite-_Ref195525577'></span>[[#_Ref195525577|Figure 6]] presents the electrical conductivity of several silver-based inks, both pure and modified with different nanoparticle loadings. The unmodified silver ink achieves a conductivity of approximately 2.58 × 10⁴ S/m, which increases significantly with the addition of nanomaterials. Incorporating 1 %wt. GNP increases the conductivity by roughly 7% over the baseline, whereas a 2 %wt. GNP modification boosts it to approximately 2.4 times the original value. In comparison, adding 1 %wt. CNT-GNP results in an increase to about 1.9 times the baseline conductivity, while the multilayer silver ink achieves a conductivity near 1.6 times that of the unmodified ink. Although the inclusion of CNT does enhance the conductivity, the improvement is lower than that observed with GNP alone. Microscopic examination of the printed circuits indicated that dispersing CNT uniformly within the silver ink is challenging, likely leading to less effective conductive network formation. This suggests that the superior performance of the GNP-modified inks is partly due to their more consistent dispersion, which facilitates better particle connectivity and, consequently, enhanced electron transport.
 <div class="center" style="width: auto; margin-left: auto; margin-right: auto;">
   [[Image:Review_199156902404-image6.png|330px]] </div>
-<div class="center" style="width: auto; margin-left: auto; margin-right: auto;">
+<div id="_Ref195525577" class="center" style="width: auto; margin-left: auto; margin-right: auto;">
 Figure 6: Conductivity values for unmodified and CNT-GNP doped silver circuits.</div>
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