Abstract

Abstract

In this research, a numerical analysis and experimental measurements of temperature stabilization of high power LED is shown, by employing a heat sink passive aluminum, designed to be used in a compact lamp configuration. The research proves that our system maintains the LED chip temperature below 70 ºC, allowing optimal long-term performance of the device [1]. The simulation to treat heat transfer in the heat sink has been made by implementing software that works with finite element analysis. Likewise, experimental simulations were performed on a low-cost prototype ready to install on street lighting. Experimental measurements in different configurations show good agreement with numerical calculations.

Abstract

Materials combining a certain degree of macroporosity and high thermal conductivity are interesting for current active thermal management applications. In this work a new class of multiphase composite porous materials have been fabricated. The materials are inspired by a recently developed family of high thermally conductive composite materials formed by combination of graphite flakes, ceramic particles and a metal matrix. Replacing the ceramic particles by NaCl particles allow obtaining an interconnected pore structure in the material after dissolution in water. Materials with aluminum matrices have been obtained by gas pressure infiltration of preforms conformed by mixtures of graphite flakes and NaCl particles. The thermal conductivity has been calculated and experimental results are discussed in accordance with two mathematical models based on ideal microstructures: i) alternated layers of semi-infinite continuous graphite flakes and metallic foam, and ii) a metallic foam with oriented graphite flakes in the struts.

Abstract

The effective dispersal of thermal energy from mechanical and electronic devices is a critical function of heat sinks, especially in the dynamic electronic industry. The convergence of rising power efficiency and the need for miniaturization has underscored the significance of creating heat sink configurations that are not only efficient but also capable of maintaining performance without necessitating expansion. This review article provides an exhaustive examination of recent developments in heat transfer enhancing methods, with a specific emphasis on a range of heat sink configurations and design approaches. Thermal efficiency expressed as a pin termination circular and pin fin square is assessed in the present research, Pin Fin Elliptical, and Channel Heat Sink designs. Comparative results indicate that Pin Fin Circular exhibits good performance, while Pin Fin Elliptical shows better results. The numerical analysis includes considerations of thermal performance, surface area, manufacturing complexity, and 2D models. Pin Fin Circular, with its efficient heat dissipation and moderate complexity, emerges as a promising option. The paper evaluates the applicability of additional manufacturing processes, including EDM, etching, casting, extrusion, and machining, for prototyping and mass production. A detailed investigation of manufacturing methods shows that, contingent upon the method used, Pin and Channel designs possess unique merits and demerits. In addition, the study emphasises the importance of cost aspects during the design process. Also, the assessment examines the current status and potential future advancements of heat sink technology, placing particular emphasis on the necessity for unique designs, materials, and versatile manufacturing methods. The incorporation of Nano fluids technology and the exploration of structural design perspectives are identified as potential avenues for future research. This work aims to provide a comprehensive overview of recent developments in heat sink technology, offering insights into thermal performance enhancement and guiding future studies in this critical field.