Abstract

This paper presents a comprehensive sequence of analytical methods for evaluating printed circuit board (PCB) pressing processes, augmented by numerical finite element (FE) simulations. The study considers the properties of the prepreg material, the structure of the PCB copper layer, and various pressing process parameters, all of which can be adjusted according to specific requirements. Our results are validated through experiments and compared with the established Squeeze Flow Model. The pro posed methodology identifies potential weaknesses in the design of the copper layer, material selection, and pressing parameters prior to production. Additionally, the implementation of this methodology in an interactive user interface allows for rapid and efficient results, facilitating timely decision-making and process optimization

Abstract

Abstract

The study of weld lines in polymers is far from settled, especially in predicting how materials perform over long periods under stress. While previous research has explored the behavior of isotactic polypropylene (iPP) in both its unfilled and glass fiber-reinforced forms, the focus has been largely on short-term behavior. However, this study shifts the lens to long-term performance under complex conditions, specifically looking at creep and fatigue. We take a novel approach by considering iPP with 30% glass fiber reinforcement, using tensile samples that induce weld line formation. Creep behavior is measured across a broad range of strain rates and temperatures, aiming to understand the underlying mechanisms that govern material failure. These short-term tests are then linked to more comprehensive long-term evaluations, including cyclic loading and creep-to-rupture tests. Crack growth is assessed using CT specimens, enabling us to capture failure modes that are otherwise difficult to quantify. The study goes further by proposing a new way to model deformation. Instead of relying on traditional methods, we turn to the Eyring equation for a more accurate prediction of failure times under cyclic stress, especially as materials transition to brittle fracture at higher temperatures. These predictions match experimental results, demonstrating the potential of linear elastic fracture mechanics (LEFM) in assessing long-term material performance. Ultimately, this research challenges conventional models and provides a pathway for more accurate long-term predictions, a crucial step for industries relying on polymer materials in demanding environments.